Route and validate silicon package substrate designs critical to high speed networking product requirements. It is critical to understand manufacturing design rules, Signal Integrity and Power Integrity requirements to minimize package iterations and create working designs.
Setup the design, create routing standards and implement package route to meet the rules required for very high speed serdes and large pin count devices.
The role will require working with package and Signal Integrity engineers. Iteration with pcb, connector, and asic team may be required. Focus will be primarily on flip chip packages and heterogeneous integration chip package design.
Capability of understanding and driving to milestones to make development successful.
A complete knowledge of packaging materials and material properties is needed. The knowledge of 2.1D, 2.5D and interposer integration is a plus.
A working knowledge of Cadence Allegro Packaging Design (APD) is a must. Experience with v17.2 of APD and Cadence System in Package (SiP) is a plus. Additional knowledge of Ansys HFSS, SiWave, Icepak and Cadence XtractIM/PowerSI will be beneficial.
Degree in Electrical Engineering or related field, or equivalent experience.
7 or more years in the industry with packaging development.
Experience with several high pin count, high power and high speed packages.
Strong communication, problem solving, interpersonal and presentation/documentation skills.
location: San Jose, California
job type: Contract
salary: $45 - 55 per hour
Equal Opportunity Employer: Race, Color, Religion, Sex, Sexual Orientation, Gender Identity, National Origin, Age, Genetic Information, Disability, Protected Veteran Status, or any other legally protected group status.
Qualified applicants in San Francisco with criminal histories will be considered for employment in accordance with the San Francisco Fair Chance Ordinance.
We will consider for employment all qualified Applicants, including those with criminal histories, in a manner consistent with the requirements of applicable state and local laws, including the City of Los Angeles' Fair Chance Initiative for Hiring Ordinance.